-MOCVD wafer automatic loading and unloading
-GBT-P7A-700 (More)
-Two SCARA robots and one articulated robot are integrated with the preceding equipment to facilitate the loading and unloading process for both processed and unprocessed wafers.
-Cost reduction, increased capacity and efficiency
-Ensured labor cost savings and production stability
-Robots certified for use in a dust-free environment, meeting national cleanliness requirements
-Equipped with high-speed I/O for wafer mapping inspection
-High stability ensures gentle wafer handling and tray placement without collisions
-Wafer positioning accuracy: ±0.05mm、±0.1°
-Wafer loading and unloading Cycle Time: 425pcs/h
-High Position Repeatability (Position repeatability: 0.02mm), ensuring damage
-free during wafer loading and unloading -Jitter-free in high-speed wafer handling for efficient loading and unloading
-Yield Rate: ≥99.9%
上海捷勃特機(jī)器人有限公司 滬ICP備2020034948號-2